.: ERWIN SIAHAAN Ir., M.Si., Dr. :.

ERWIN SIAHAAN Ir., M.Si., Dr.

Bidang Ilmu

Riwayat Pendidikan

SARJANA, PROGRAM STUDI : TEKNIK SIPIL, TEKNIK SIPIL UNIVERSITAS TARUMANAGARA Pada 20-05-1980
MAGISTER, PROGRAM STUDI : MASTER ENGINEERING, MATERIALS SCIENCE UNIVERSITAS INDONESIA Pada 03-04-1997
DOKTOR, PROGRAM STUDI : ILMU BAHAN-BAHAN MATERIAL, MATEMATIKA & ILMU PENGETAHUAN ALAM UNIVERSITAS INDONESIA Pada 26-01-2015

Judul : A Comparative Study of Conventional Solder Bump and Copper Pillar Bump in Flip Chip Technology using Computational Fluid Dynamics
Link File : https://lintar.untar.ac.id/repository/penelitian/buktipenelitian_10387042_3A120921113347.pdf
Judul : Effect Of Temperature On Flexible Printed Circuit Board Layout During Reflow Soldering Process
Link File : https://lintar.untar.ac.id/repository/penelitian/buktipenelitian_10387042_3A120921112819.pdf
Judul : Karaktersitik Poros Roda Belakang Go-Kart melalui
Link File : https://lintar.untar.ac.id/repository/penelitian/buktipenelitian_10387042_10A144349.pdf