Penelitian

• Judul : A Comparative Study of Conventional Solder Bump and Copper Pillar Bump in Flip Chip Technology using Computational Fluid Dynamics

  Link File : https://lintar.untar.ac.id/repository/penelitian/buktipenelitian_10387042_3A120921113347.pdf
  

• Judul : Effect Of Temperature On Flexible Printed Circuit Board Layout During Reflow Soldering Process

  Link File : https://lintar.untar.ac.id/repository/penelitian/buktipenelitian_10387042_3A120921112819.pdf
  

• Judul : Karaktersitik Poros Roda Belakang Go-Kart melalui

  Link File : https://lintar.untar.ac.id/repository/penelitian/buktipenelitian_10387042_10A144349.pdf
  

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